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JSC00120 Low-profile IC cooler

A thin fan sink with a heat sink and fan arranged in parallel (L90.0 x W45.0 x H11.6 mm)

JARO Thermal's fan-equipped heatsink adopted for mass production by global semiconductor manufacturers, graphic card manufacturers, and PC manufacturers. "JSC00120" IC cooler - Specially designed for slim devices. - Low power consumption and low thermal resistance. - Operates with low noise to CFM ratio. - RoHS compliant.

  • logo JARO Thermal.png
  • fan
  • IC cooler for equipment

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Data Center Heat Management: IC Coolers for Low-Profile Equipment

Slim design with a height of 11.6mm. Parallel arrangement of the fan and heat sink accommodates IC cooling in limited spaces.

In data centers, efficient thermal management in limited space is required due to the high density of servers and network equipment. The JARO Thermal "JSC00120" is a slim IC cooler with fans and heat sinks arranged in a parallel configuration. With a low-profile design of L90.0 × W45.0 × H11.6mm, it is suitable for equipment with height constraints on cooling components. 【Features】 - Slim design with a height of 11.6mm - Parallel arrangement of fans and heat sinks - Cooling structure that directs airflow horizontally - Low power consumption and low thermal resistance - RoHS compliant It can be used for IC cooling in servers, network equipment, graphics cards, GPUs, FPGAs, and more. For detailed information on the structure and fluid analysis results of the JSC00120, click here.

  • logo JARO Thermal.png
  • fan
  • IC cooler for equipment

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IC cooler for low-profile devices for industrial PCs

Slim design with a height of 11.6mm. Space-saving IC cooler with fans and heat sinks arranged in parallel.

In industrial PCs, it is important to efficiently cool ICs that generate heat within limited chassis space. The JARO Thermal "JSC00120" is a slim IC cooler with a fan and heat sink arranged in parallel horizontally. With a low-profile design of 11.6mm in height, it is suitable for devices with height constraints on cooling components. 【Usage Scenarios】 - Industrial PCs and network devices - Network cards - Graphics cards and video cards - FPGAs, GPUs, processors, controllers - IC cooling for slim and space-saving devices 【Features】 - Slim design with a height of 11.6mm - Parallel arrangement of fan and heat sink - Cooling structure that directs airflow horizontally - Low power consumption and low thermal resistance - RoHS compliant For detailed explanations of the structure, airflow, and fluid analysis results of the JSC00120, please refer to the detailed description.

  • logo JARO Thermal.png
  • fan
  • IC cooler for equipment

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